1. Applications of experimental mechanics to electronic packaging -1997- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
المؤلف: sponsored by the Electrical and Electrnic Packaging Division, ASME, the Applied Mechanics Division, ASME; edited by J.C. Suhling, K.M. liechti, S. Liu
المکتبة: (طهران)
موضوع: Electronic packaging - Congresses , Mechanics, Applied - Congresses
رده :
TK
7870
.
15
.
A643
1997
2. MEMS and nanotechnology.proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics
المؤلف: Gordon Shaw III, Barton C. Prorok, LaVern Starman, Cosme Furlong, editors
المکتبة: كتابخانه و مركز اسناد دانشگاه كردستان (کردستان)
موضوع: Congresses ، Microelectromechanical systems,Congresses ، Nanotechnology,، Engineering,، Nanotechnology and Microengineering,، Theoretical and Applied Mechanics,، Nanotechnology
رده :
TK7875
